Mainly used in glass cutting such as mobile phone screens. The picosecond laser uses a laser beam to sweep the processed material multiple times to achieve cutting. The calculation algorithm makes the laser expand in multiple levels on one surface, and also expand in height multiple times.

The hardware platform plan is rtc5 plus a motion platform control card. Realize the seamless splicing of multiple pieces, the perfect combination of processing quality and large size.

Use a high-resolution camera for processing positioning and galvanometer correction. Under the magnifying glass and CCD, there is no trace of splicing at all.